CAP-XX is a US corporation that designs manufactures, and markets world-leading, high power density supercapacitors. These devices are an ideal power solution in mobile wireless devices, digital cameras, medical appliances, industrial and automotive applications, and many other devices.

With their high power and energy densities, supercapacitors are capable of producing the high burst power required, for example, when taking a digital photo, sending wireless phone or PDA transmissions, providing back-up energy, or hot-swapping battery packs. As the use of mobile technology advances, the need for smaller, portable, and more highly functional devices grows. This, in turn, intensifies the demand for battery power systems that are compact and light, but still provide long run times.

CAP-XX supercapacitors will increasingly become the critical enabling technology that allows OEMs to achieve significant savings in cost, component count, mass, weight, and circuit complexity.

CAP-XX products are the result of pioneering supercapacitor research, materials expertise and superior production technologies. The Company teams with CSIRO, Australia 's largest research body, for world-class expertise in carbons, polymers, electrochemistry, and materials science, and partners with Invetech to utilize the innovative product and manufacturing processes.

CAP-XX's breakthrough technology makes it the first company to tailor its supercapacitors to achieve a wide and continuous range of time constants. Devices are produced over a wide spectrum of time constants (as related to response time) to suit specific applications with the right combination of high power and energy densities.

The CAP-XX supercapacitor is a single cell rated at 2.25V. Each single cell device consists of layers in pairs. Dual cell devices are designed to meet specific customer applications and are rated at 4.5V.

The current product mix includes a range of 20 dual cell products with customized layers, two footprint sizes, and two electrolytes. This provides wide coverage of ESR, capacitance and size for wide range wireless, consumers and commercial applications.

•  High capacitance of 10mF to 2.8F yields high energy density

• Low ESR of 20 to 115 m W yields high power density

• Small footprint of 28.5 mm x 17 mm for the W series and 39 mm x 17 mm for the S series

• Wafer thin profile of 0.7 - 3.9 mm

• Light-weight packaging